Power chips are attached to external circuits with product packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation refers to the electrical link on the top surface of the chip, which is usually light weight aluminum bonding cord in conventional modules. ^
Conventional power module plan cross-section
Currently, business silicon carbide power modules still primarily utilize the packaging technology of this wire-bonded conventional silicon IGBT component. They encounter troubles such as large high-frequency parasitic criteria, not enough warmth dissipation capability, low-temperature resistance, and insufficient insulation strength, which limit using silicon carbide semiconductors. The screen of superb efficiency. In order to address these issues and totally manipulate the substantial potential advantages of silicon carbide chips, lots of new packaging modern technologies and remedies for silicon carbide power components have actually emerged recently.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold wires to copper cords, and the driving force is expense decrease; high-power tools have established from aluminum cables (strips) to Cu Clips, and the driving force is to enhance item performance. The higher the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to typical bonding product packaging techniques, Cu Clip innovation has the following benefits:
1. The link in between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the standard cord bonding method between the chip and the pins. Consequently, a special bundle resistance value, greater existing circulation, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can fully save the cost of silver plating and inadequate silver plating.
3. The item appearance is completely consistent with normal products and is primarily made use of in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding method is more costly and intricate, but it can achieve far better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The source pad makes use of a Clip approach, and the Gate uses a Cable method. This bonding method is slightly less costly than the all-copper bonding technique, saving wafer area (applicable to extremely little gate locations). The process is simpler than the all-copper bonding approach and can obtain much better Rdson and much better thermal result.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding braided copper wire, please feel free to contact us and send an inquiry.
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